Welcome to the 2024 TRF Topical Workshop!
Location and Date: Oakland, CA; October 7-9
TRF Topical Workshop on Hybrid and Heterogeneous Microsystems
Workshop Overview
This workshop will bring together researchers, engineers, and industry experts to exchange ideas and
strategies for future microsystems technologies based on hybrid and heterogeneous integration of
CMOS, MEMS, 2D semiconductors, silicon photonics, spintronics, and non-silicon semiconductors (e.g.
GaN, SiC, and others). Areas of interest include heterogeneous microsystems, materials and devices,
and packaging and hybrid integration technologies (e.g. exfoliation of 2D materials, layer transfer, wafer
bonding, and chip-to-wafer bonding). Attendees will be drawn from academia, industry, government
agencies and laboratories, and the start-up and venture investment communities. A unique aspect of this
workshop will be the inclusion of start-up founders and early-stage investors who will share their
perspectives on the challenges and opportunities for microsystems technologies and the potential impact
of the CHIPS Act on the field. Following the workshop, the organizers and key stakeholders will prepare a
high-quality technical report/white paper that can serve as an authoritative document for government,
industry leaders ,and policymakers to identify critical funding needs.
Submit Your Abstract!
Abstract deadline Aug 14!
Submit your 1-page abstract for an oral or poster presentation to share your work. The workshop will not provide any printed proceedings, so feel free to share results that you would rather not have distributed electronically or in print.
Topics!
Hybrid and heterogeneous integration of CMOS with other technologies
•MEMS, Silicon photonics, wide bandgap materials, and 2D semiconductors
•Packaging and hybrid integration technologies
•Applications
•Manufacturing and commercialization
Special Session!
- Optomechanical Thermal Imaging (DARPA OpTIm)
- Levitated and Trapped Accurate microSystems (DARPA LeviTAS)
Keynote Speakers
Dan Armbrust
Semiconductor Executive, Co-founder, Board Director, & initial COE of Silicon Catalyst
Title Talk: Revitalizing Semiconductor Startups
Daniel Armbrust is co-founder and director of Silicon Catalyst which incubates semiconductor startups. Its portfolio companies have raised more than $0.5B in venture funding and are valued at over $1.9B. Armbrust serves as an advisor, board member, board chairman and angel investor for many semiconductor startups. Daniel is an affiliate with Lawrence Berkeley National Labs and recently was appointed to the Industrial Advisory Committee, which advises the Department of Commerce on the R&D strategy for the CHIPS Act. He served as President and CEO of the SEMATECH semiconductor consortium and held various positions in semiconductor manufacturing and development over 25 years at IBM.
Tsu-Jae King Liu
Dean, College of Engineering, UC Berkeley
Dean and Roy W. Carlson Professor of Engineering, College of Engineering
Distinguished Professor of Electrical Engineering and Computer Sciences
Title Talk: TBD
Tsu-Jae King Liu was born in Ithaca, NY and raised in the San Francisco Bay Area. She attended Stanford University, where she earned her undergraduate and graduate degrees in Electrical Engineering before joining the Xerox Palo Alto Research Center as Member of Research Staff in 1992. In 1996 she joined the faculty of the Department of Electrical Engineering and Computer Sciences at the University of California, Berkeley, where she is currently Dean of the College of Engineering. Dr. Liu’s research contributions in the field of semiconductor microelectronics have been recognized by many awards, most recently the 2024 IEEE Founders Medal.
Dana Weinstein
Professor, Electrical and Computer Engineering, Purdue University
Senior Research Fellow, Krach Insititute of Tech Diplomacy at Purdue
Principal Assistant Director & Special Advisor for CHIPS R&D, Industrial Innovation, White House Office of Science and Technology Policy
Title Talk: TBD
Dana Weinstein is a Professor in Purdue’s Elmore Family School of Electrical and Computer Engineering. Prior to joining Purdue in 2015, Dr. Weinstein was a Professor at MIT in the Department of Electrical Engineering and Computer Science at MIT as an Assistant Professor. She received her B.A. in Physics and Astrophysics from UC Berkeley in 2004 and her Ph.D. in Applied Physics in 2009 from Cornell. She is a Purdue Faculty Scholar, and a recipient of the NSF CAREER Award, the DARPA Young Faculty Award, the first Intel Early Career Award, the first TRF Transducers Early Career Award, and the IEEE IEDM Roger A. Haken Best Paper Award. Dr. Weinstein’s current research focuses on innovative microelectromechanical devices for applications ranging from MEMS-IC wireless communications and clocking to harsh environment sensors and ultrasonic stimulation. This year, Professor Weinstein is serving as the Principal Assistant Director for Microelectronics Research and Development at the White House Office of Science and Technology Policy in DC. In that role, she is also a champion for accelerating materials innovation through autonomous experimentation for sustainable semiconductors.
Location
Venue: Oakland Campus, Northeastern University, Lisser Hall
Address: 5000 MacArthur Boulevard, Oakland, California
Sponsored by:
